Semiconductor Factory Insurance Malaysia | E&E P&E Guide
Malaysia's semiconductor and E&E factories house some of the highest-value assets in any industry. This guide breaks down the complete property and engineering insurance programme for fab operations, cleanroom facilities, and electronics manufacturing. Published Date: 2026-02-12
Malaysia's electrical and electronics sector accounts for roughly 38% of the country's total exports. A single semiconductor fab line can hold RM2 billion or more in equipment. When a wafer lithography machine costs RM150 million and a power surge can destroy an entire production batch worth RM5 million in seconds, standard factory insurance doesn't come close.
This guide covers the complete property and engineering (P&E) insurance programme that semiconductor, chip packaging, PCB assembly, and electronics manufacturing facilities in Malaysia actually need.
You'll find:
- Why E&E factories need a different insurance approach than general manufacturing
- EEI as the primary coverage for cleanroom and fab equipment
- How to classify equipment between EEI, MB, and IAR
- Business interruption exposure and the three loss-of-profits policies
- Cleanroom-specific risks that standard policies miss
- Premium factors and sum insured challenges for high-value facilities
- Three real-world claim scenarios with RM breakdowns
Why Semiconductor and E&E Factories Need Specialised Insurance
General manufacturing insurance was designed for factories where the building is the most valuable asset. In semiconductor and E&E facilities, the equipment inside is worth 5 to 20 times more than the building itself. That single fact changes everything about how you structure coverage.
A typical Malaysian semiconductor fab with 300mm wafer capacity houses equipment worth RM500 million to RM3 billion. The cleanroom structure adds another RM50 million to RM200 million. The building shell? Maybe RM30 million to RM80 million. Your insurance programme needs to reflect this reality.
| Risk Factor | General Manufacturing | Semiconductor / E&E |
|---|---|---|
| Equipment-to-building value ratio | 1:1 to 2:1 | 5:1 to 20:1 |
| Single equipment unit value | RM100K to RM5M | RM5M to RM200M |
| Daily production loss | RM50K to RM500K | RM1M to RM10M |
| Environmental sensitivity | Moderate | Extreme (temperature ±0.5°C, humidity ±2%, particle count Class 1-100) |
| Power quality dependency | Standard grid acceptable | UPS + dual feed mandatory; microsecond interruptions cause losses |
| Lead time for replacement equipment | 2 to 12 weeks | 6 to 18 months for fab tools |
| Chemical hazard level | Low to moderate | High (pyrophoric gases, corrosive chemicals, toxic materials) |
| Primary insurance need | Fire/IAR + MB | EEI + ILOP as foundation, then IAR + MB + BI |
The bottom line: E&E facilities need EEI as the primary policy, not fire or IAR. The equipment drives the risk, the equipment drives the premium, and the equipment drives the claim.
Complete P&E Insurance Programme for E&E Facilities
A semiconductor or E&E factory needs six to eight policies working together. No single policy covers everything. The key is making sure there are no gaps between policies and no double-charging for overlapping coverage.
| Policy | What It Covers | Priority for E&E | Typical Sum Insured Range |
|---|---|---|---|
| EEI (Electronic Equipment Insurance) | All electronic/electrical equipment against sudden unforeseen physical damage | Essential | RM100M to RM3B |
| ILOP (Increased Cost of Working / Loss of Profits) | Revenue loss from EEI-covered equipment breakdown | Essential | RM50M to RM500M |
| IAR (Industrial All Risks) | Building, cleanroom structure, general contents, stock | Essential | RM50M to RM500M |
| BI (Business Interruption) | Revenue loss from IAR-covered perils (fire, flood, etc.) | Essential | RM100M to RM1B |
| MB (Machinery Breakdown) | Mechanical equipment (chillers, compressors, CDA systems, boilers) | Essential | RM20M to RM200M |
| MLOP (Machinery Loss of Profits) | Revenue loss from MB-covered mechanical breakdowns | Recommended | RM30M to RM200M |
| CGL (Comprehensive General Liability) | Third-party bodily injury and property damage | Required | RM5M to RM50M |
| WC (Workmen Compensation) | Employee injury/death (foreign workers mandatory) | Required | Statutory |
The sequence matters. EEI + ILOP comes first because your electronic equipment is your highest-value asset. IAR + BI covers the building and fire perils. MB + MLOP covers the mechanical support systems that keep your cleanrooms running.
EEI: The Primary Coverage for Semiconductor and E&E Equipment
Electronic Equipment Insurance (EEI) is the backbone of any E&E factory insurance programme. It covers sudden and unforeseen physical damage to electronic and electrical equipment from any cause not specifically excluded. This is broader than fire insurance (named perils only) and covers internal faults that IAR doesn't touch.
What EEI Covers in a Semiconductor Facility
| Equipment Category | Examples | Typical Value per Unit | EEI Covered? |
|---|---|---|---|
| Lithography / photolithography systems | Stepper, scanner, EUV systems | RM50M to RM200M | Yes |
| Deposition systems | CVD, PVD, sputtering, epitaxy | RM5M to RM30M | Yes |
| Etch systems | Plasma etch, wet etch, dry etch | RM3M to RM20M | Yes |
| Ion implantation | Medium current, high current, high energy | RM10M to RM40M | Yes |
| Inspection and metrology | SEM, AFM, optical inspection, CD-SEM | RM2M to RM15M | Yes |
| Wire bonding and packaging | Die attach, wire bonders, moulding, trim/form | RM500K to RM5M | Yes |
| Testing equipment | ATE (automatic test equipment), burn-in ovens, handlers | RM1M to RM20M | Yes |
| UPS and power systems | UPS units, PDUs, transformers, switchgear | RM2M to RM20M | Yes |
| Cleanroom HVAC controls | BMS, environmental monitoring, FFU controllers | RM1M to RM10M | Yes |
| Process control systems | DCS, PLC, SCADA, MES servers | RM500K to RM5M | Yes |
EEI Covered Causes of Loss
EEI operates on an "all risks" basis for covered equipment. That means it covers any sudden and unforeseen physical damage unless specifically excluded. The most common causes of loss in E&E facilities include:
| Cause of Loss | E&E Relevance | Example |
|---|---|---|
| Electrical surge / power fluctuation | Very high: fab equipment is voltage-sensitive | TNB grid surge damages stepper optics and control boards |
| Short circuit / arcing | High: high-voltage plasma and RF systems | Arc flash in etch chamber destroys electrodes and chamber lining |
| Operator error | High: complex equipment requires trained operators | Incorrect recipe loaded causes wafer handler collision |
| Vibration damage | High: lithography systems are vibration-sensitive to nanometre levels | Nearby construction vibration misaligns stepper optics |
| Water damage (non-flood) | High: cleanroom has extensive DI water and chemical piping | DI water pipe burst floods sub-fab, damaging pump controllers |
| Chemical contamination | High: corrosive gases and chemicals throughout | Acid leak corrodes adjacent equipment wiring and connectors |
| Design / manufacturing defect | Moderate: complex systems with many failure points | Defective bearing in turbo pump causes catastrophic failure |
Key EEI Exclusions for E&E Facilities
EEI doesn't cover everything. The exclusions that matter most for semiconductor operations:
| Exclusion | What It Means | Alternative Coverage |
|---|---|---|
| Wear and tear / gradual deterioration | Consumable parts, aging components, scheduled replacements | Maintenance budget / OEM service contract |
| Aesthetic defects | Scratches or dents that don't affect function | None needed |
| Consequential loss / loss of profits | Revenue lost during equipment downtime | ILOP (must be added separately) |
| Fire, explosion, lightning | These perils are covered under IAR/Fire policy | IAR or Fire Insurance |
| Natural catastrophe (flood, earthquake) | Standard EEI excludes nat-cat perils | IAR with special perils extension |
| Data and software | Lost programs, recipes, data on storage media | EEI external data media extension or cyber policy |
The fire exclusion is the one that catches people off guard. If a fire destroys your RM50 million lithography system, the EEI policy won't pay. Your IAR or fire policy covers fire damage to all assets including electronic equipment. This is why you need both EEI and IAR working together.
Equipment Classification: EEI vs MB vs IAR
E&E facilities have a mix of electronic, electrical, and mechanical equipment. Getting the classification right prevents gaps and avoids paying for the same asset under two policies. The rule is straightforward: if it processes electronic signals or requires precision electrical control, it goes under EEI. If it has moving mechanical parts as its primary function, it goes under MB.
| Equipment | Primary Function | Correct Policy | Why |
|---|---|---|---|
| Lithography stepper/scanner | Precision optical/electronic | EEI | Electronic/optical system with precision controls |
| CVD / PVD chambers | Plasma/vacuum process | EEI | Electronically controlled process equipment |
| ATE test systems | Electronic testing | EEI | Electronic measurement and test equipment |
| UPS systems | Power conditioning | EEI | Electronic power conversion equipment |
| Chillers (water-cooled) | Mechanical cooling | MB | Rotating mechanical equipment (compressor-driven) |
| CDA compressors | Compressed air generation | MB | Rotating mechanical equipment |
| Vacuum pumps (dry/turbo) | Mechanical vacuum generation | MB | Rotating mechanical equipment |
| Scrubbers and abatement systems | Chemical exhaust treatment | MB | Mechanical process equipment |
| Cleanroom panels, raised floor, FFU structure | Building infrastructure | IAR | Permanent building fixture |
| Chemical storage tanks and piping | Storage infrastructure | IAR | Building contents / fixed infrastructure |
| Wafers in process (WIP) | Stock / inventory | IAR | Stock-in-trade under property policy |
| Finished goods inventory | Stock / inventory | IAR | Stock-in-trade under property policy |
Grey area alert: Some equipment falls between categories. Fan filter units (FFUs) with electronic variable-speed drives could go under either EEI or IAR. Gas delivery systems with electronic mass flow controllers could be EEI or MB. Work with your broker to agree on classification before binding, not after a claim.
Business Interruption: The Three Loss-of-Profits Policies
For most manufacturing plants, business interruption is a secondary concern after property damage. For semiconductor facilities, it's often the other way around. A fab running at capacity can generate RM2 million to RM10 million in revenue per day. Equipment replacement takes 6 to 18 months. The production loss from a single equipment failure can exceed the cost of the damaged equipment itself.
Three separate loss-of-profits policies exist, each triggered by a different underlying cause:
| Policy | Trigger | What It Pays | Typical Indemnity Period | E&E Priority |
|---|---|---|---|---|
| BI (Business Interruption) | Fire, flood, natural perils (IAR-covered events) | Gross profit loss + increased cost of working | 12 to 24 months | Essential |
| ILOP (Loss of Profits on EEI) | Electronic equipment breakdown (EEI-covered events) | Gross profit loss + increased cost of working | 12 to 18 months | Essential |
| MLOP (Loss of Profits on MB) | Mechanical equipment breakdown (MB-covered events) | Gross profit loss + increased cost of working | 12 months | Recommended |
Why E&E Factories Need All Three
Here's the scenario that illustrates the problem. Your chiller breaks down (MB event). Without cooling, cleanroom temperature rises above spec within 30 minutes. All wafer processing stops. You lose RM3 million per day in production for 8 weeks while the chiller is repaired.
If you only have BI (fire/IAR trigger), the chiller breakdown doesn't trigger a payout because it's not a fire or named peril. You need MLOP to cover production losses from mechanical breakdowns. And you need ILOP for when an EEI-covered electronic failure causes the same cascade.
| Scenario | Cause | Material Damage Policy | Loss-of-Profits Policy | Estimated Production Loss |
|---|---|---|---|---|
| Fire in chemical store spreads to cleanroom | Fire | IAR | BI | RM300M+ (12-18 month rebuild) |
| Power surge destroys stepper optics | Electrical | EEI | ILOP | RM50M to RM150M (6-12 month lead time) |
| Chiller compressor seizure shuts down cooling | Mechanical | MB | MLOP | RM30M to RM80M (4-8 week repair) |
| Monsoon flood damages sub-fab | Flood | IAR (special perils) | BI | RM100M to RM500M (contamination + equipment damage) |
Indemnity period matters more in E&E than any other industry. Standard BI policies offer 12-month indemnity. But if your lithography system takes 12 months to replace and 3 months to qualify, you need at least 18 months. Underinsuring the indemnity period is the single most expensive mistake in semiconductor insurance.
Cleanroom-Specific Risks and Coverage Gaps
Cleanrooms create insurance challenges that standard industrial policies weren't designed for. The cleanroom itself is a building component (IAR), but everything inside it needs EEI or MB coverage. And the interaction between the cleanroom environment and the equipment creates risks that fall between policies if you're not careful.
Cleanroom Risk Categories
| Risk | Description | Insurance Implication |
|---|---|---|
| Contamination cascade | One equipment leak contaminates entire cleanroom, affecting all tools | Single event, multiple equipment claims under EEI; decontamination costs under IAR |
| HVAC failure cascade | Cooling loss causes temperature excursion, damaging process and wafers | HVAC = MB claim; wafer WIP loss = IAR (stock); production loss = MLOP |
| Chemical gas leak | Toxic or pyrophoric gas escapes, requiring evacuation and decontamination | Equipment damage = EEI; third-party injury = CGL; employee injury = WC; cleanup = IAR |
| Vibration damage | External vibration (construction, traffic) misaligns precision tools | Covered under EEI if it causes sudden physical damage to the equipment |
| Static discharge (ESD) | Electrostatic discharge damages wafers or equipment components | Equipment damage = EEI; wafer loss = IAR (stock) |
| Water intrusion | Pipe burst or roof leak introduces moisture into cleanroom | Building damage = IAR; equipment damage = EEI; production loss depends on trigger |
The critical lesson: cleanroom incidents almost always involve multiple policies paying simultaneously. A single gas leak can trigger claims under EEI (equipment corrosion), IAR (structural damage, stock loss), CGL (third-party injury), WC (employee exposure), and ILOP (production shutdown). Your broker needs to coordinate all these policies at placement, not at claims time.
Sum Insured Challenges in E&E Facilities
Getting the sum insured right in a semiconductor facility is harder than in any other industry. Equipment values are massive, they change rapidly as technology evolves, and replacement costs can be very different from book value. Underinsurance triggers the average clause, which reduces your claim payout proportionally.
Sum Insured Approaches by Asset Type
| Asset Type | Valuation Basis | Common Pitfall | Recommended Approach |
|---|---|---|---|
| Fab equipment (current gen) | Replacement value new | Using purchase price from 3-5 years ago; new model costs 20-40% more | Update to current OEM pricing annually |
| Fab equipment (legacy/discontinued) | Functional replacement value | Insuring for book value (near zero); replacement = new gen at 3x cost | Insure for cost of equivalent-capability new equipment |
| Cleanroom structure | Reinstatement value | Excluding installation and qualification costs | Include tear-down, rebuild, and requalification |
| WIP (wafers in process) | Selling price at current process step | Valuing at raw wafer cost; a wafer at final test can be worth 50x raw cost | Use graduated value by process step |
| Finished goods | Market value / selling price | Not accounting for seasonal demand peaks | Insure for peak stock holding value |
Wafer WIP Valuation: A Unique Challenge
A blank 300mm silicon wafer costs roughly RM500 to RM2,000. By the time it reaches final testing, that same wafer can hold chips worth RM50,000 to RM500,000 depending on the product. Your IAR stock coverage needs to reflect the maximum WIP value at any point in the production cycle, not just the raw material cost.
| Process Stage | Approximate Value per Wafer (300mm) | Typical WIP Lot Quantity | Lot Value |
|---|---|---|---|
| Bare wafer (incoming) | RM500 to RM2,000 | 25 wafers | RM12,500 to RM50,000 |
| After front-end processing (50%) | RM5,000 to RM50,000 | 25 wafers | RM125,000 to RM1.25M |
| After full front-end (100%) | RM10,000 to RM100,000 | 25 wafers | RM250,000 to RM2.5M |
| After testing and dicing | RM50,000 to RM500,000 | 25 wafers | RM1.25M to RM12.5M |
A large fab can have 5,000 to 20,000 wafers in process at any time. At an average WIP value of RM30,000 per wafer, that's RM150 million to RM600 million in WIP alone. Many facilities insure WIP under IAR stock at a fraction of this amount.
Premium Factors for E&E Facility Insurance
E&E factory insurance premiums are driven by different factors than standard manufacturing. The concentration of high-value assets in a controlled environment creates both higher rates and more underwriter scrutiny. Here's what determines your premium.
| Factor | Impact on Premium | What Underwriters Look For |
|---|---|---|
| Total sum insured (TSI) | Primary driver: higher TSI = more capacity needed = harder placement | Detailed asset list with individual equipment values |
| PML (Probable Maximum Loss) | Very high: concentrated values mean single event can destroy RM billions | Fire compartmentation, cleanroom separation, sub-fab layout |
| Fire protection | 15-30% discount for comprehensive FM Global-grade systems | Double interlock pre-action sprinklers, VESDA, gas suppression in sub-fab |
| Chemical hazard management | High: pyrophoric gases (silane, phosphine) and corrosive chemicals | Gas detection, automated shutoff, chemical isolation, ventilation rates |
| Power redundancy | 10-20% reduction for dual-feed + UPS + generator | N+1 or 2N redundancy, UPS ride-through time, generator start time |
| Maintenance programme | 5-15% credit for documented preventive maintenance | OEM service contracts, PM schedules, spare parts inventory |
| Claims history | 20-50% swing based on 5-year loss record | Loss ratio, frequency, root cause analysis, corrective actions |
| Natural catastrophe exposure | Significant: flood zone, earthquake proximity | Location flood mapping, elevation, drainage, seismic zone |
| Deductible level | Higher deductible = lower premium (10-25% saving for 2x deductible) | Ability to absorb smaller losses |
Indicative Premium Ranges for Malaysian E&E Facilities
| Facility Type | Total Sum Insured | EEI Rate (% of SI) | IAR Rate (% of SI) | Total P&E Premium Estimate |
|---|---|---|---|---|
| PCB assembly plant | RM50M to RM200M | 0.15% to 0.30% | 0.10% to 0.20% | RM150K to RM700K |
| Chip packaging (OSAT) | RM100M to RM500M | 0.12% to 0.25% | 0.08% to 0.15% | RM300K to RM1.5M |
| Semiconductor test facility | RM200M to RM800M | 0.10% to 0.20% | 0.08% to 0.15% | RM500K to RM2M |
| Wafer fabrication (200mm) | RM500M to RM2B | 0.08% to 0.18% | 0.06% to 0.12% | RM1M to RM5M |
| Wafer fabrication (300mm) | RM1B to RM5B | 0.06% to 0.15% | 0.05% to 0.10% | RM2M to RM10M |
These are indicative ranges only. Actual premiums depend heavily on the specific risk profile, loss history, and insurer appetite. Semiconductor risks above RM1 billion total sum insured typically require reinsurance placement in the London or Singapore market, which adds lead time and complexity to the renewal process.
Need a P&E programme review for your E&E facility? Talk to our specialists
Malaysia's E&E Manufacturing Corridors
Malaysia's semiconductor and E&E sector is concentrated in specific industrial zones. Each corridor has different risk profiles that affect insurance placement and pricing.
| Corridor | Key Zones | Major Operations | Insurance Considerations |
|---|---|---|---|
| Penang | Bayan Lepas FIZ, Prai Industrial | Wafer fab, OSAT, PCB, LED, EMS | Flood risk in Prai; highest concentration of E&E assets; mature infrastructure |
| Kulim / Kedah | Kulim Hi-Tech Park | Wafer fab (advanced nodes), solar, sensors | New builds with modern fire protection; lower flood risk; newer infrastructure |
| Selangor / KL | Petaling Jaya, Shah Alam, Cyberjaya | OSAT, testing, design centres | Flash flood risk (2021 Shah Alam floods); urban congestion affects fire response |
| Johor | Senai, Pasir Gudang, Iskandar | OSAT, passive components, connectors | Chemical zone proximity (Pasir Gudang); supply chain to Singapore |
| Melaka / Negeri Sembilan | Ayer Keroh, Krubong, Senawang | Passive components, power semiconductors | Lower land cost but older infrastructure; smaller facilities |
Location affects more than just flood risk. Penang's concentration of E&E facilities means insurers have significant accumulated exposure. A single major flood event in Bayan Lepas FIZ could trigger billions in claims across multiple policies. Some insurers actively manage their Penang E&E exposure, which can affect capacity and pricing for new placements.
Three Claim Scenarios: How P&E Policies Respond
Scenario 1: Power Surge Destroys Lithography System
A voltage transient from the TNB grid bypasses the UPS system during a switchover and hits the fab power distribution. The surge damages the optics module and wafer stage of a 193nm immersion lithography scanner. The tool is down for 9 months while replacement parts are manufactured and shipped from Japan.
| Loss Component | Policy | Amount |
|---|---|---|
| Lithography optics and wafer stage repair | EEI | RM28,000,000 |
| UPS rectifier replacement | EEI | RM1,200,000 |
| Other equipment control board damage (6 tools) | EEI | RM3,500,000 |
| WIP loss (wafers in litho queue destroyed) | IAR (stock) | RM4,800,000 |
| Production loss (9 months reduced output) | ILOP | RM85,000,000 |
| Expediting costs (air freight, OEM overtime) | EEI (extension) | RM2,500,000 |
| Total claim | EEI + IAR + ILOP | RM125,000,000 |
The equipment damage (RM32.7 million) is less than a third of the total loss. Without ILOP, this facility absorbs RM85 million in uninsured production losses. The 9-month repair timeline is realistic for major lithography repairs because parts are custom-manufactured.
Scenario 2: Chemical Gas Leak in Cleanroom
A silane (SiH4) gas line develops a leak at a fitting in the CVD area. Silane is pyrophoric and ignites on contact with air. The resulting fire is contained by the gas suppression system but not before damaging 4 CVD tools, contaminating a 500m² cleanroom section, and exposing 3 workers to toxic fumes.
| Loss Component | Policy | Amount |
|---|---|---|
| 4 CVD tools (fire + contamination damage) | IAR (fire peril) | RM18,000,000 |
| Cleanroom decontamination and rebuild (500m²) | IAR | RM5,000,000 |
| Adjacent equipment cleaning and recertification | IAR | RM2,000,000 |
| WIP destroyed in affected zone | IAR (stock) | RM3,500,000 |
| Employee medical treatment and compensation | WC | RM450,000 |
| Production loss (4 months partial shutdown) | BI | RM40,000,000 |
| Total claim | IAR + BI + WC | RM68,950,000 |
Because the cause was fire (silane ignition), the IAR policy responds for property damage, not EEI. The BI policy covers the production loss because it's triggered by an IAR-covered peril. This is why equipment classification by peril matters: the same equipment can be claimed under different policies depending on what caused the damage.
Scenario 3: Chiller Failure Causes Cleanroom Temperature Excursion
The primary chiller serving Cleanroom 2 suffers a compressor seizure at 2am. The backup chiller fails to auto-start due to a control logic error. Cleanroom temperature rises from 22°C to 35°C over 90 minutes before operators intervene. By then, 800 wafers in process have exceeded thermal specifications and are scrapped. 12 temperature-sensitive tools require recalibration.
| Loss Component | Policy | Amount |
|---|---|---|
| Chiller compressor repair/replacement | MB | RM800,000 |
| Backup chiller control board replacement | EEI | RM150,000 |
| 800 wafers scrapped (WIP at various stages) | IAR (stock) * | RM12,000,000 |
| 12 tools recalibration and requalification | Disputed ** | RM1,500,000 |
| Production loss (3 weeks partial shutdown) | MLOP | RM15,000,000 |
| Total claim | MB + EEI + IAR + MLOP | RM29,450,000 |
* The WIP loss from temperature excursion is a grey area. Some insurers argue this is consequential loss from the MB event (excluded from IAR). Others accept it as sudden physical damage to stock. Your policy wording needs to address this explicitly.
** Tool recalibration after temperature excursion may not meet the threshold for "physical damage" under either EEI or MB. This is a common coverage dispute in semiconductor claims. The best approach is to negotiate a "recalibration extension" into your EEI policy at renewal.
P&E Programme Structure by Facility Type
Not all E&E facilities need the same insurance programme. A PCB assembly plant has very different risk characteristics from a wafer fab. Here's how to prioritise coverage based on your operation type.
| Facility Type | Must-Have Policies | Recommended Add-Ons | Key Risk |
|---|---|---|---|
| Wafer fabrication | EEI, ILOP, IAR, BI, MB, MLOP, CGL, WC | Environmental liability, transit insurance | Massive BI exposure; single tool failure = RM50M+ loss |
| OSAT (packaging and test) | EEI, ILOP, IAR, BI, MB, CGL, WC | Bailee's clause (customer's goods), MLOP | Customer WIP liability; multiple client exposure |
| PCB manufacturing | IAR, BI, EEI, MB, CGL, WC | ILOP, environmental liability (chemical waste) | Chemical fire risk; etching chemical storage |
| LED / optoelectronics | EEI, ILOP, IAR, BI, MB, CGL, WC | MLOP, product liability | MOCVD equipment value; cleanroom contamination |
| EMS / contract manufacturing | IAR, BI, EEI, MB, CGL, WC | Bailee's clause, product liability, ILOP | Customer material exposure; SMT line fire risk |
| Semiconductor test facility | EEI, ILOP, IAR, BI, CGL, WC | Bailee's clause, MB for cooling systems | ATE equipment value; high customer WIP |
OSAT and test facilities: don't forget the bailee's clause. You're holding your customer's wafers and chips. If a fire or equipment failure destroys their property, you're liable. Standard CGL excludes property in your care, custody, and control. You need a specific bailee's clause in your IAR or a separate bailee's policy.
Not sure which policies your E&E facility needs? Get a free P&E gap analysis
Common Insurance Mistakes in E&E Facilities
After reviewing hundreds of E&E factory insurance programmes across Malaysia, these are the mistakes we see most often. Each one creates a coverage gap that only becomes visible when you file a claim.
| Mistake | What Happens | How to Fix |
|---|---|---|
| No EEI policy; relying on IAR alone | Electrical surges, internal faults, and operator errors to equipment are not covered | Add EEI for all electronic/electrical equipment |
| EEI but no ILOP | Equipment is repaired but production loss (often 5-10x equipment cost) is uninsured | Always pair EEI with ILOP |
| WIP insured at raw material cost | RM300M in processed wafers covered for RM5M in raw silicon value | Use graduated WIP valuation by process stage |
| 12-month indemnity period | Replacement tool arrives at month 10; qualification takes 4 months; 2 months uninsured | Extend to 18-24 months for critical tools |
| Equipment insured at book value | 5-year-old stepper at book value RM20M; replacement cost RM120M | Insure at replacement new value; update annually |
| No bailee's coverage (OSAT/test) | Customer's RM50M in wafers destroyed; you're liable but uninsured | Add bailee's clause to IAR or standalone bailee's policy |
| Separate brokers for each policy | Gap between EEI/IAR/MB triggers; coverage disputes at claims | Use one broker to coordinate the full P&E programme |
FAQ
What is the most important insurance policy for a semiconductor factory in Malaysia?
Electronic Equipment Insurance (EEI) is the most important policy because semiconductor facilities are dominated by high-value electronic and electrical equipment. EEI covers sudden unforeseen physical damage including electrical surges, operator errors, and internal faults that IAR and fire insurance exclude. Always pair EEI with ILOP (Increased Cost of Working / Loss of Profits) to cover production losses from equipment downtime.
How much does semiconductor factory insurance cost in Malaysia?
Total P&E programme costs range from RM150,000 per year for a small PCB assembly plant to RM10 million or more for a large 300mm wafer fab. EEI rates typically run 0.06% to 0.30% of the sum insured depending on facility type, fire protection, and claims history. The total premium depends on the sum insured, deductible levels, and coverage breadth.
Does IAR cover electronic equipment in an E&E factory?
Yes, IAR covers electronic equipment against fire, flood, and other named/all-risks perils. But IAR does not cover internal electrical faults, power surges, operator errors, or mechanical breakdown of the equipment itself. That's why E&E facilities need EEI in addition to IAR. The two policies work together: IAR for fire and external perils, EEI for internal and electrical causes of loss.
What is ILOP and why do E&E factories need it?
ILOP stands for Increased Cost of Working / Loss of Profits, and it's the loss-of-profits policy linked to EEI. When an EEI-covered equipment failure causes production downtime, ILOP pays for the lost revenue and additional costs to maintain operations. E&E factories need ILOP because production losses from a single major equipment failure can reach RM50 million to RM150 million, often exceeding the cost of the damaged equipment itself.
How should I insure wafers in process (WIP) in my fab?
Insure WIP under your IAR policy at the maximum aggregate value at any point in the production cycle, using graduated valuation by process stage. A bare wafer worth RM1,000 can be worth RM100,000 or more after processing. Calculate the total WIP by multiplying average wafer-in-process count by average value per wafer at the median process stage. Review and update this figure quarterly.
What's the difference between BI, ILOP, and MLOP for an E&E factory?
BI (Business Interruption) covers production losses from IAR-covered events like fire and flood. ILOP covers production losses from EEI-covered events like electrical surges and equipment faults. MLOP covers production losses from MB-covered events like chiller or compressor breakdowns. Each policy only triggers when its parent material damage policy responds. E&E factories need all three because production can stop from fire, electronic failure, or mechanical failure.
Do OSAT and chip packaging companies need different insurance from wafer fabs?
Yes. OSAT facilities have two unique risks: they hold customer-owned wafers and chips (requiring a bailee's clause), and they typically have lower equipment values but higher throughput volumes. The bailee's exposure can be significant because a fire destroying RM50 million in customer products creates liability that standard CGL excludes. The core P&E programme (EEI, IAR, MB, BI) is the same but with bailee's coverage as a must-have addition.
How long should my indemnity period be for semiconductor equipment?
At least 18 months for critical fab equipment, and 24 months for lithography systems and other long-lead-time tools. The indemnity period needs to cover equipment replacement time (6-18 months for fab tools) plus qualification and ramp-up time (2-4 months). Standard 12-month indemnity periods consistently underinsure semiconductor facilities.
Does insurance cover cleanroom contamination from an equipment failure?
It depends on the cause. If a fire causes contamination, IAR covers cleanup costs. If a chemical leak from an equipment failure causes contamination, coverage is split between EEI (equipment damage) and IAR (building/cleanroom decontamination). The grey area is when contamination damages other equipment or spoils WIP. Work with your broker to ensure policy wordings clearly address contamination scenarios and their coverage triggers.
Should my E&E factory use one broker for all insurance policies?
Yes. Using a single broker who understands P&E insurance for manufacturing ensures your policies work together without gaps or overlaps. When multiple brokers handle different policies, coverage disputes at claims time become far more likely. A coordinated P&E programme with one broker also gives you better negotiating power on rates because insurers prefer comprehensive programme placements.
Foundation Conclusion
Malaysia's semiconductor and E&E facilities are among the most valuable industrial operations in the country. The insurance programme needs to match the scale and complexity of these operations, with EEI and ILOP as the foundation, IAR and BI for fire and property perils, and MB and MLOP for the mechanical systems that keep cleanrooms running.
The cost of getting it wrong is measured in hundreds of millions. A single underinsured equipment failure or a missing ILOP policy can wipe out years of profit. Getting the right mix of P&E policies is not optional for E&E operations; it's a core business risk management requirement.
Talk to our P&E specialists about your semiconductor or E&E facility insurance programme
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